Lead Electronic Engineer of Gaming Headset

职位简介 您将加入我们快速发展的 C4C 游戏硬件团队，担任专注于下一代有线和无线游戏耳机的电气工程专家。在此职位中，您将定义产品规格、选择关键零部件、推动与外部 JDM 合作伙伴的联合开发项目、主导 EVT 测试，并确保从概念设计到量产的全流程技术卓越。 您的核心贡献 规格与架构定义： 为游戏音频产品定义全面的 EE 规格、框图及 BOM 成本目标。 联合开发与供应商管理： 推动与 ODM/JDM 供应商的系统开发。审查供应商的原理图设计、PCB Layout 及技术方案；提供技术指导和可操作的反馈，以提升设计质量、信号完整性/电源完整性 (SI/PI) 以及可靠性。 测试与验证： 制定 EVT 计划，定义测量流程，并指导供应商完成验证。亲身参与 EMC、ESD、电源管理及噪声调试工作。 跨部门协作： 与 FW（固件）、ME（结构）及 Acoustics（声学）等跨功能团队合作，解决系统集成挑战。 生产支持与失效分析： 主导试产阶段技术问题的根本原因分析 (Root Cause Analysis)，并在量产爬坡阶段提供技术支持。 文档编写： 提供清晰、高质量的技术文档、架构概述及测试报告。 核心

学历背景： 电气工程、电子工程或相关技术专业的学士或硕士学位。 EE 开发经验： 8 年以上消费电子领域实操硬件开发经验，重点关注有线或无线音频产品。 具备扎实的电源与电池管理、SI/PI（信号完整性与电源完整性）分析以及混合信号设计背景。 供应商协作： 具有与 ODM/JDM 合作伙伴合作的成功记录，包括技术评估、设计审查和问题排查。 工具与技能： 精通 EDA 工具（如 Cadence OrCAD、Allegro、Siemens PADS），能够进行原理图与 PCB Layout 审查。 具备扎实的实验室操作经验与技能，包括使用 Audio Precision 进行音频信号测量与分析。 期望的技能 天线与 RF 专长： 具备天线设计、仿真、调谐和测量的经验。具有 2.4GHz 私有无线或蓝牙音频经验者优先。 游戏音频 SoC： 熟悉主流无线音频 SoC（如 Qualcomm、Actions、Airoha、Realtek、Nordic）及硬件电路。 合规认证： 熟悉合规性法规（EMC、ESD、RF）。 语言与沟通： 英语听说读写流利，能够与多地全球团队高效协作。 Lead Electronic Engineer of Gaming Headset Role You will join our rapidly growing C4C Gaming Hardware Team, serving as the Electrical Engineering expert focused on next-generation wired and wireless gaming headsets. In this role, you will define product specifications, select key components, drive joint-development projects with external ODM/JDM partners, lead EVT testing, and ensure technical excellence from concept through mass production. Key Responsibilities Specification & Architecture Definition: Define comprehensive EE specifications, block diagrams, and BOM cost target for gaming audio products. Joint Development & Vendor Management: Drive system development with ODM/JDM suppliers. Review supplier schematic designs, PCB layouts, and technical proposals; provide technical guidance and actionable feedback to improve design quality, SI/PI, and reliability. Testing & Validation: Formulate EVT plans, define measurement procedures, and guide suppliers through validation. Hands-on involvement in EMC, ESD, power management, and noise debugging. Cross-Functional Collaboration: Partner with cross-functional teams, including FW, ME, and Acoustics, to resolve integration challenges. Production Support & Failure Analysis: Lead root cause analysis for technical issues during pilot build stages and provide technical support through mass production ramp-up. Documentation: Deliver clear, high-quality technical documentation, architecture overviews, and test reports. Basic Qualifications Education: Bachelor’s or Master’s degree in Electrical Engineering, Electronic Engineering, or a related technical discipline. EE Experience: 8+ years of hands-on hardware development experience in consumer electronics, with a focus on wired or wireless audio products Strong background in power and battery management, SI/PI (signal integrity and power integrity) analysis, and mixed mode design. Vendor Collaboration: Proven track record of working with ODM/JDM partners, including technical evaluation, design reviews, and issue troubleshooting. Tools & Skills: Proficient in EDA tools (e.g., Cadence OrCAD, Allegro, Siemens PADS) for schematic and PCB layout review. Solid experience and skills in lab works, including audio signal measurement and analysis by Audio Precision. Preferred Qualifications Antenna & RF Expertise: Experience with antenna design, simulation, tuning, and measurement. Experience in 2.4GHz proprietary wireless or Bluetooth audio is a plus. Gaming Audio SoC: Familiarity with mainstream wireless audio SoCs (e.g., Qualcomm, Actions, Airoha, Realtek, Nordic) and hardware circuits Compliance: Familiar with compliance regulations (EMC, ESD, RF). Language & Communication: Fluent in English (both written and spoken) to collaborate effectively across multi-site global teams. #LI-LZ1/51SZ/LP