Lead Acoustic Engineer of Gaming Headset

职位简介 作为罗技 “在中国，为中国 (In China for China)”战略硬件工程部旗下 Gaming iCafe 耳机团队的“声音架构师” ，您将致力于突破传统声学的行业局限 。结合本土硬核玩家对 FPS 游戏“听声辩位”的极致需求，您将拉通罗技全球顶级创新资源与优质 JDM 供应商，专为中国电竞网吧及电竞酒店环境打造零延迟、高分离度的物理级定位音频体验，确立罗技在电竞声学领域的绝对标杆 。 您的核心贡献 系统级声学设计： 综合运用声学、电子（EE）和结构（ME）跨学科知识，主导耳机的前后腔体设计与气流阻抗微调 。应用物理声学与硬件架构分离技术，在有效隔离低频的同时，精准保留中高频的游戏脚步声 。 本土化声学调优： 深度对接本土优质 JDM 供应链合作伙伴，负责电竞场景（如 FPS/MOBA）下目标曲线（Target Curve）的设定，以及 53mm 驱动单元、特定材质振膜等核心声学硬件的选型、调校与测试验证 。 全链路验证与测试： 制定并执行针对网吧复杂噪声环境的声学测试标准，包括全频段总谐波失真（THD）测试、被动降噪（PNR）性能评估等 。 电竞体验反馈体系： 主导并建立面向职业电竞选手及硬核玩家的盲测与主观听音反馈机制，将玩家真实体验转化为可量化的声学改进指标 。 跨职能技术协同： 与项目管理、电子、固件及结构设计团队紧密协作，确保声学方案在整机系统集成、功耗及无线射频层面达成最佳平衡 。

与技能要求 从业背景： 拥有 10 年左右耳机系统开发或声学研发经验，具备深厚的声学或 EE（电子工程）技术背景 。 产品经验： 必须具备游戏头戴式耳机（Gaming Headset）的实际完整开发与全流程量产交付经验 。 行业履历： 优先考虑来自游戏耳机产品生态链（具全流程量产经验）、游戏耳机大型代工厂/ODM（具备整机视角）或主流游戏耳机 IC 厂商/顶级代理商（如 FAE/AE 核心技术背景）的人才 。 系统级认知： 具备强大的“系统级整合与验证”能力而非单一零部件研发经验 。熟悉蓝牙、USB Audio 及 2.4G 无线音频技术的底层架构 。 硬件工程协同： 熟悉基础硬件工程概念，包括 PCB 设计（如通过多层板规避 EMI/ESD 问题）、功耗管理及 RF 天线调试配合 。 方案评估能力： 能够独立对比分析整合型单芯片（SoC）与多组件拆分方案的优劣，并能敏锐、精准地判断系统级声学/音频问题的归属（软件 vs 硬件） 。 软性素质与心态： 具备创业心态，能够完全适应中国本土高频、快速迭代的开发周期，具备在模糊或不确定环境下拍板技术决策的魄力 ；表现出明确的领导/技术管理潜力及卓越的跨部门沟通协作能力 。 Lead Acoustic Engineer of Gaming Headset The Role As the "Sound Architect" for our iCafe headset engineering team within Logitech's strategic "In China for China" (ICFC) division , you will push the boundaries of traditional acoustics. By analyzing and targeting the ultimate acoustic positioning needs of local hardcore gamers, you will leverage Logitech's global engineering resources and top-tier local JDM suppliers to deliver a zero-latency, high-separation physical-level positional audio experience. Your mission is to set an absolute benchmark for esports acoustics tailored specifically for China's unique internet cafe and esports hotel environments. Your Contribution System-Level Acoustic Design: Synthesize acoustic, electrical engineering (EE), and mechanical engineering (ME) disciplines to lead the design of headset front/rear cavities and fine-tune airflow impedance. Implement physical acoustics and hardware architecture separation technologies to effectively isolate low frequencies while preserving critical mid-to-high frequency footstep sounds. Localized Acoustic Tuning: Deeply collaborate with local JDM suppliers to define specific Target Curves optimized for gaming scenarios (FPS/MOBA). Lead the selection, testing, and validation of acoustic hardware components, including 53mm driver units and specialized diaphragms. Full-Lifecycle Validation & Testing: Establish and execute rigorous acoustic testing standards optimized for the unique noise profiles of internet cafe environments, including full-frequency Total Harmonic Distortion (THD) tests and Passive Noise Reduction (PNR) evaluations. Esports Experience Evaluation: Architect and drive a subjective listening and blind-testing feedback ecosystem partnering directly with professional esports players to continuously refine sound signatures. Cross-Functional Collaboration: Partner closely with internal project management, electronic, firmware, and mechanical teams to ensure acoustic architectures seamlessly integrate with hardware and system constraints. Your Qualifications and Skills Experience: Around 10 years of robust experience in headset system development, backed by a profound technical foundation in acoustics or Electrical Engineering (EE). Product Track Record: Direct, hands-on engineering and mass-production development experience with gaming over-ear headsets is mandatory. Industry Background: Preferred experience from the gaming headset ecosystem (with full-lifecycle mass production tracking), gaming headset contract manufacturers/ODMs, or mainstream gaming headset IC vendors and premium agents. System Integration Knowledge: Possess deep system-level integration capabilities rather than single-component experience. Familiarity with wireless and wired audio technologies, including Bluetooth, USB Audio, and 2.4G wireless protocols. Hardware & RF Familiarity: Comfortable interacting with broad hardware engineering concepts, including multi-layer PCB layouts (to mitigate EMI/ESD issues), power management, and RF antenna debugging. Solution Architecture Evaluation: Ability to independently evaluate the performance and acoustic trade-offs of highly integrated SoC solutions versus discrete multi-component configurations, with a sharp capability to differentiate between hardware and software root causes. Mindset & Leadership: Entrepreneurial mindset with the resilience to thrive within fast-paced, iterative R&D cycles and make definitive technical decisions under ambiguous circumstances. Demonstrates strong cross-functional communication skills and clear leadership or technical management potential. #LI-LZ1/51SZ/LP