Head of Gaming Headset, Hardware Engineering

罗技是那些希望自己的行动能对全球产生积极影响，同时又能以自己的方式灵活实现这一目标的士的最佳选择。 职位简介 作为罗技“在中国，为中国”（C4C）战略产品开发团队的核心成员，您将带领一支全新的电竞耳机硬件团队，进军并颠覆竞争激烈的网咖和电竞酒店市场。您不仅是一位技术专家，更是连接罗技全球创新资源与中国高速、动态竞争格局的重要桥梁。您将负责组建一支高效的本地硬件工程团队，打造具备极致性价比、超低延迟并能完美适应复杂网咖环境的创新耳机产品。 您的核心贡献 系统架构与选型： 主导电竞网咖耳机系统的全生命周期开发、规范制定与定义。评估主流音频芯片平台并进行可行性研究，在实现10/20ms超低延迟的同时优化成本结构。 特定环境优化： 优化射频（RF）增益、天线覆盖范围以及2.4G私有协议性能，解决网咖环境固有的复杂干扰、续航焦虑及合规性挑战。 供应商与生态系统管理： 管理优质JDM代工厂及核心IC供应商。通过数据手册分析评估早期技术方案，具备出色的成本谈判与技术把控能力。 跨部门协作： 协调电子（EE）、结构（ME）、固件（FW）和声学工程（AE）团队，同时与罗技全球音频团队对接，将全球先进技术转化为针对中国市场定制的本地化功能。 团队建设与领导力： 在苏州组建并扩充一支高效的硬件工程团队，指导技术专家并建立完善的工程人才梯队。 设计评审与验证： 开展硬件设计评审、故障排查和文档编写。与测试团队配合制定全面的测试用例，确保在产品最终组装前捕捉电子故障。

与技能要求 工作经验： 10年以上硬件设计及耳机系统开发经验，具备深厚的声学（AE）或电子工程（EE）背景。 行业背景： 优先考虑具备游戏耳机生态系统背景（拥有全生命周期量产经验）、游戏耳机ODM/CM经验（具备团队组建及ODM视角），或主流游戏耳机芯片厂商/代理商背景（如FAE/AE背景）。 产品专业能力： 具备良好的往绩表现，且必须具备游戏头戴式包耳耳机的开发经验。 技术技能： 具备出色的系统级集成能力（包括系统集成与验证，不局限于单一零部件）。精通蓝牙、USB音频及2.4G无线技术。 硬件工程： 具备电路板设计、PCB布局优化（如通过多层板设计缓解EMI/ESD问题）、电源管理及RF天线调试经验。 方案评估： 能够独立评估集成SoC与分立多元件方案，并能准确诊断系统根本原因（软件与硬件问题区分）。 软技能与心态： 具备创业心态，能够在快速、迭代的开发周期中茁壮成长，并在存在不确定性的情况下作出果断判断。具备优秀的领导力潜质和跨部门沟通能力。 Head of Gaming Headset, Hardware Engineering Logitech is the Sweet Spot for people who want their actions to have a positive global impact while having the flexibility to do it in their own way. The Role As a core member of Logitech’s strategic "In China for China" (C4C) product development team, you will lead a brand-new gaming headset hardware team to break into and disrupt the highly competitive internet cafe and esports hotel market. You are not only a technical expert but also a vital bridge connecting Logitech’s global innovation resources with China’s high-speed, dynamic competitive landscape. You will be responsible for building an efficient local hardware engineering team and delivering innovative headset products featuring extreme cost-performance, ultra-low latency, and perfect adaptation to complex internet cafe environments. Your Contribution System Architecture & Selection: Lead the full-lifecycle development, specification, and definition of the gaming iCafe headset system. Evaluate mainstream audio chipset platforms and conduct feasibility studies to optimize cost structures while achieving 10/20ms ultra-low latency. Environment-Specific Optimization: Optimize RF gain, antenna coverage, and 2.4G proprietary protocol performance to address the unique interference, battery life anxiety, and compliance challenges inherent in internet cafe environments. Vendor & Ecosystem Management: Manage premium JDMs and key IC suppliers. Evaluate early-stage technical solutions through data-sheet analysis, utilizing strong cost-negotiation and technical oversight capabilities. Cross-Functional Collaboration: Coordinate with Electrical (EE), Mechanical (ME), Firmware (FW), and Acoustic engineering(AE) teams, while interfacing with Logitech’s Global Audio team to transform advanced global technologies into localized features tailored for the China market. Team Building & Leadership: Build and scale a high-performing hardware engineering team in Suzhou, mentoring technical experts and establishing a robust engineering pipeline. Design Review & Validation: Conduct hardware design reviews, troubleshooting, and documentation. Partner with the test team to define comprehensive test cases to capture electronic failures prior to final product assembly. Your Qualifications and Skills Experience: 10+ years of experience in hardware design and headset system development, with a deep background in Acoustics (AE) or Electrical Engineering (EE). Industry Background: Preferred experience from the gaming headset ecosystem (full-lifecycle mass production experience), gaming headset ODMs/CMs (team building and ODM perspective), or mainstream gaming headset IC vendors/agents (e.g., FAE/AE background). Product Expertise: Proven track record and mandatory experience in developing gaming over-ear headset products. Technical Skills: Strong system-level integration capabilities within system integration and validation (not limited to single components). Proficient in Bluetooth, USB Audio, and 2.4G wireless technologies. Hardware Engineering: Experience working on board design, PCB layout optimization (e.g., multi-layer boards to mitigate EMI/ESD issues), power management, and RF antenna debugging. Solution Evaluation: Ability to independently evaluate integrated SoC vs. discrete multi-component solutions, and accurately diagnose system root causes (software vs. hardware). Soft Skills & Mindset: Entrepreneurial mindset with the ability to thrive in fast-paced, iterative development cycles and make decisive judgments under ambiguity. Strong leadership potential and excellent cross-functional communication skills. #LI-LZ1/51SZ/LP