Lead Firmware Engineer of Gaming Headset

职位简介 作为罗技 “在中国，为中国”（C4C）战略产品开发团队的核心团队的“中枢神经连接者”，您将负责打造专属的低延迟、高抗干扰无线连接体验。您将成为罗技全球前沿音频算法在中国落地的第一推进者，利用敏捷策略将尖端音频提取与智能降噪技术转化为本地产品的差异化竞技优势。 您的核心贡献 平台适配与开发： 基于现有成熟的主流无线音频 SoC 平台，进行系统架构的设计、底层固件开发及代码优化。 前沿算法落地与整合： 与罗技全球软件与算法团队深度协作，主导评估并移植最前沿的音频 DSP 处理、空间音频虚拟化算法及动态声音提取技术到本地硬件产品上。 低延迟与连接调优： 优化蓝牙与 2.4G 私有协议的通信逻辑，确保无线耳机在极端复杂的干扰环境下的极速响应，并管理多模连接与电池调度等核心逻辑。 核心

与技能要求 从业背景： 具备丰富的主流音频 SoC 平台（包含市面常见高性价比与旗舰平台）的底层固件开发经验，有电竞耳机或低延迟外设成功量产案例。 技术能力： 精通 C/C++ 及嵌入式 RTOS 开发，深刻理解音频 DSP 处理机制、空间音频算法,熟悉主流音频 SoC 方案，熟练掌握蓝牙,LE Audio, USB Audio 及 2.4G 无线底层技术与 RF 射频调试。 软性素质： 拥有卓越的跨国协作与英文沟通能力（需频繁对接海外顶级算法研发团队），学习敏锐度高，能快速吸收新技术框架并转化为可量产代码。 为什么加入 Logitech 中国研发团队？ 战略高位： 你将负责罗技全球产品组合的重要补充，直接参与从 0 到 1 的品牌与新细分品类建设。 全球资源： 既享有中国初创团队的敏捷与灵活性，又能充分杠杆罗技全球顶级的创新实验室与庞大的供应链资源。 Lead Firmware Engineer of Gaming Headset The Role As the "central nervous system connector" of the team, you will be responsible for creating a dedicated, low-latency, and highly interference-resistant wireless connection experience. You will be the primary driver for implementing Logitech's cutting-edge global audio algorithms in China, utilizing agile strategies to translate advanced audio extraction and intelligent noise cancellation technologies into differentiated competitive advantages for local products. Your Contribution Platform Adaptation & Development: Based on existing, mature, mainstream wireless audio SoC platforms, you will be responsible for system architecture design, low-level firmware development, and code optimization. Frontier Algorithm Implementation & Integration: Deeply collaborate with Logitech's global software and algorithm teams to lead the evaluation and porting of cutting-edge audio DSP processing, spatial audio virtualization algorithms, and dynamic sound extraction technologies to local hardware products. Low Latency & Connection Tuning: Optimize communication logic for Bluetooth and 2.4G proprietary protocols to ensure rapid response for wireless headsets in extremely complex interference environments, and manage core logic such as multi-mode connection and battery scheduling. Your Qualifications and Skills Professional Background: Extensive experience in low-level firmware development for mainstream audio SoC platforms (including common cost-effective and flagship platforms on the market); proven track record of successful mass production of gaming headsets or low-latency peripherals. Technical Skills: Proficiency in C/C++ and embedded RTOS development; deep understanding of audio DSP processing mechanisms and spatial audio algorithms; familiarity with mainstream audio SoC solutions; mastery of Bluetooth, LE Audio, USB Audio, and 2.4G wireless low-level technologies, as well as RF debugging. Soft Skills: Excellent cross-national collaboration and English communication skills (frequent interaction with top-tier overseas algorithm R&D teams required); high learning agility, with the ability to quickly absorb new technology frameworks and convert them into mass-producible code. #LI-LZ1/51SZ/LP