2027届-现场工艺工程师（上海）

1.完成现场装机任务，满足客户验机要求。

2.解决客户现场工艺问题，通过数据分析，实验测试，团队合作等方式找出事故背后真实原因

3.和研发团队紧密合作，评估更多新研发机台，通过数据分析，实验组合，高效合作等多种方式持续改进研发机台性能，以满足客户长期的性能要求。

4.作为客户和产品团队的联系桥梁，需要时刻和客户保持良好关系，充分沟通

5.帮助公司销售团队了解更多现场情况 （如竞争对手状态，客户产线增长情况等），抢占更多市场份额

6.必要情况需要出差以支援其他技术服务团队

1. Performs all standard service activities through Tier II without assistance and Tier III with limited assistance

2. Responds to fab process issues and perform trouble shooting in customer site with limited assistance. With instruction from supervisor, to carry out root cause analysis, action plans, report finding and actively work with HW team and product team on finding solution.

3. With instruction from supervisor, work closely with product team to design, collect data, analyze and compile reports on a variety of new process penetration.

4. With instruction from supervisor, collect customer technical information, competitor status and periodically summarize to upper levels to clearly understand about the situation and adjust next step plan accordingly

5. Co-work and build up good relationship with customer, and handle customer request to make them satisfied

6. Need to travel within China for customer support if needed.

7. Other tasks assigned by supervisor.

1.对半导体制造工艺流程有一定的了解

2.对半导体设备行业充满热情，强烈的学习意愿和能力，能够快速掌握新知识和新技能。

5.积极主动，认真细致，具备良好的沟通能力和团队协作精神。

6.优秀的英文读写能力

7.具备较强的抗压能力和解决问题的韧性。

1. Have a basical understanding of the IC process flow

2. Enthusiastic about the semi equipment industry, with a strong desire and ability to learn, capable of quickly mastering new knowledge and skills.

3. Good working attitude and communication (External and Internal) skill is required

4. Understands how the assigned duties relate to others in the team

5. Outstanding stress-resistance ability

6. Excellent English reading and writing skills