2027校招-封装工程师/Packaging Engineer

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness - Participate in cross-functional teams, supporting product

and production, helping to meet reliability and yield requirements, design testability, and test coverage - Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages. - Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs. As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy. Put your talent to work with us as a Packaging engineer ! Preferred Qualifications: - Basic understanding of statistical process control (SPC) - Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA) - Demonstrated analytical and problem solving skills - Strong written and verbal communication skills - Ability to work in teams and collaborate effectively with people in different functions - Strong time management skills that enable on-time project delivery - Ability to build strong, influential relationships - Ability to work effectively in a fast-paced and rapidly changing environment - Ability to take the initiative and drive for results Texas Instruments will not sponsor job applicants for visas or work authorization for this position.