2027校招-封装工程师/Packaging Engineer

and production, helping to meet reliability and yield requirements, design testability, and test coverage - As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the top engineering minds in the industry at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the workplace-you will be treated with respect, dignity, kindness and courtesy. 1. Hiring Role function PM Role: - End-to-End Project Management: Lead and drive the full lifecycle of new packaging technologies, ensuring all technical milestones, quality gates, and timelines are met across multiple product platforms. - Innovation & Technology Introduction: Drive the conceptualization and industrialization of innovative packaging solutions; stay abreast of emerging assembly trends and integrate new materials or methodologies into TI's technology roadmap. - Hands-on Problem Solving: Take a proactive, hands-on approach to identify, analyze, and resolve complex technical bottlenecks during the development and qualification phases, ensuring robust technology transfers. - Cross-Functional Orchestration: Serve as the central hub between Business Units (BU) and internal technical teams (Design, Process, Quality, Operation and Manufacturing) to synchronize requirements and resolve complex integration issues. - Risk & Resource Management: Proactively identify technical risks and resource constraints; coordinate cross-departmental support to ensure seamless technology transitions and successful mass production. PreBond DA Role: - Hiring position is for Wafer Backgrind, Wafer Singulation and Die Attach process - Develop and industrialize Die Preparation process (Back Grind / Wafer Taping & Mount / Wafer Saw - Dicing) including equipment, new process methodology, and introduce materials to meet quality, cost, yield and mission of new applications. - Support wafer dicing/singulation process development across laser dicing, plasma dicing and mechanical saw technologies. - Develop and industrialize Epoxy Dispense Die Attach process, to meet quality, cost, yield and mission of new applications. - Die Preparation and Die Attach process Development & Characterization, Qualification, and production pilot run to improve package performance on quality, cost, reliability and application. Put your talent to work with us as a Packaging engineer!
Preferred Qualifications: - Graduate with a master’s degree in fields of mechanical engineering, physics or semiconductor packaging knowledge (manufacturing processes, assembly, reliability, materials, characterization, failure analysis) - Basic understanding of statistical process control (SPC), statistical analysis tools (JMP), FMEA, Control plan - Analytical and problem-solving skills e.g. DOE, 8D, Process Mapping, Fish Bond - Proactive and self-driven with a strong sense of ownership; able to take initiative in driving tasks and seeking solutions in a dynamic environment. - Results-oriented mindset with a focus on achieving milestones and delivering high-quality work through disciplined execution. - Strong coordination and interpersonal skills, with the potential to effectively drive collaboration among cross-functional team members. - Strong time management skills that enable on-time project delivery, ability to take the initiative and drive for results - Experience with any agentic AI methodology to enhance work productivity - Good at Microsoft software – power point, excel and outlook. - Strong written and verbal communication skills in English - Texas Instruments will not sponsor job applicants for visas or work authorization for this position.