光模块硬件测试工程师（常驻泰国）

1.聚焦800G高速数据中心光模块的硬件专项测试，覆盖QSFP-DD、OSFP等主流封装形态，完成PAM4信号眼图、链路损耗、TX/RX性能、功耗等核心硬件指标的全维度验证，匹配云厂商数据中心的严苛部署要求。

2.基于数据中心场景的实际组网环境搭建测试链路，完成与主流交换机、服务器端口的互联互通兼容性测试，复现数据中心真实业务流量下的硬件性能表现，输出场景化测试报告。

3.熟练操作高速采样示波器、误码仪、矢量网络分析仪等高端测试仪表，完成TDR阻抗测试、S参数分析、高速链路信号完整性专项测试，定位硬件电路中的信号衰减、阻抗不匹配等隐性问题。

4.针对数据中心光模块的高低温循环、长期老化、插拔耐久等可靠性测试环节，跟踪硬件性能变化趋势，分析硬件失效模式，联动硬件研发团队完成问题根因定位与整改验证。

5.参与高速数据中心光模块硬件测试规范的制定，沉淀800G/1.6T产品的测试方法论，优化测试流程，配合团队提升硬件测试的自动化覆盖率，缩短产品验证周期。

1. Specialized in hardware testing of 800G high-speed data center optical modules (QSFP-DD, OSFP). Fully verify core metrics including PAM4 eye diagram, link loss, TX/RX performance and power consumption to meet strict data center deployment standards.

2. Build scenario-based test links, conduct compatibility and interoperability tests with mainstream switches and servers. Validate hardware performance under real service traffic and deliver targeted test reports.

3. Skilled in operating high-speed oscilloscopes, BER testers and vector network analyzers. Complete TDR impedance test, S-parameter and signal integrity analysis to locate signal attenuation, impedance mismatch and other latent hardware issues.

4. Conduct reliability tests including temperature cycling, long-term aging and plug durability. Track hardware performance changes, analyze failure modes, and cooperate with R&D teams for root cause analysis and rectification verification.

5. Participate in formulating hardware test specifications for high-speed optical modules. Summarize 800G/1.6T test methodologies, optimize test processes, improve test automation coverage and shorten product validation cycles.

1.本科及以上学历，光电信息、通信工程、电子科学与技术等相关专业，4年以上高速光模块硬件测试经验，有800G及以上数通光模块项目测试经历者优先。

2.深入理解数据中心光互联架构，熟悉800G及以上光模块的DSP驱动、TIA放大等核心硬件链路逻辑，掌握OIF、IEEE 802.3等数通光模块行业标准规范。

3.精通PAM4信号测试方法，能够独立完成高速信号眼图分析、信号抖动分解、误码率压力测试等专项工作，可快速定位高速链路中的硬件性能瓶颈。

4.能够独立输出完整的高速硬件测试报告、失效分析报告，具备较强的问题拆解能力，可配合研发团队完成高速硬件问题的复现、定位与闭环验证。

5.了解数据中心光模块的实际部署场景与业务痛点，能接受短期客户现场出差支持，工作严谨细致，具备较强的跨部门协同意识与技术钻研精神。

1. Bachelor’s degree or above, major in Optoelectronic Information, Communication Engineering, Electronic Science and Technology or related fields. Minimum 4‑years hardware testing experience on high‑speed optical modules; prior project testing experience with 800G+ data‑com optical modules is preferred.

2. In‑depth understanding of data‑center optical interconnection architecture. Familiar with core hardware link logic of 800G+ optical modules including DSP driver and TIA amplification. Well‑versed in industry standards such as OIF and IEEE 802.3 for data‑com optical modules.

3. Proficient in PAM4 signal testing methodologies. Capable of independently conducting special tests including high‑speed signal eye‑diagram analysis, jitter decomposition and BER stress testing, and quickly identifying hardware performance bottlenecks in high‑speed links.

4. Able to independently deliver complete high‑speed hardware test reports and failure analysis reports. Strong problem‑decomposition capability; work with R&D teams to reproduce, locate and close the loop for high‑speed hardware issues.

5. Understand real‑world deployment scenarios and business pain‑points of data‑center optical modules. Accept short‑term on‑site business trips for customer support. Meticulous working style, good cross‑department collaboration awareness and solid technical research aptitude.