【2027届应届生】电子工程师

在资深工程师指导下，参与光模块产品的硬件电路设计，协助完成原理图设计并整理相关设计文件。

参与 IC 物料选型与外围电路设计，协助评估电路设计方案，满足产品功能要求。

参与产品电路设计 DFMEA（设计失效模式与影响分析）的编制与维护。

参与产品初始样品的功能电路测试与特性调测，记录并分析测试数据。

协助完成测试 PCB 的设计，参与 PCB/PCBA 的验收及相关验收文件的整理。

配合市场部与生产部，协助应对客户及生产端的功能电路问题，提供基础技术支持。

参与料号申请、ECR/ECN 等工程变更流程的处理，协助维护产品 BOM 与设计资料。

参与产品性能参数优化与失效分析，支持提升生产良率、降本增效；配合其他部门进行测试板的设计开发。

完成上级安排的其他事项。 Responsibilities

Under the guidance of senior engineers, participate in hardware circuit design for optical module products; assist in schematic design and prepare related design documents.

Participate in IC component selection and peripheral circuit design; assist in evaluating circuit design solutions to meet functional requirements.

Participate in the preparation and maintenance of DFMEA (Design Failure Mode and Effects Analysis) for product circuit design.

Participate in functional circuit testing and characterization of initial samples; record and analyze test data.

Assist in the design of test PCBs; participate in PCB/PCBA acceptance and the preparation of related acceptance documents.

Cooperate with the marketing and production departments to help address customer and production-side functional circuit issues, providing basic technical support.

Participate in part-number requests and engineering change processes (ECR/ECN); assist in maintaining product BOM and design documentation.

Participate in product performance parameter optimization and failure analysis to support yield improvement and cost reduction; cooperate with other departments on test board design and development.

Complete other tasks assigned by the supervisor.

硕士及以上学历，电子科学与技术、电子信息工程、通信工程、微电子、自动化、光电信息等相关专业。

具备模拟电路、数字电路基础，了解高速电路设计与信号完整性基本概念。

了解原理图设计与 PCB 设计流程，接触过 Cadence、Altium Designer 等 EDA 设计软件者优先。

了解光模块基本原理与常见光电接口，了解 IEEE 802.3、OIF、MSA 等光模块行业标准者优先。

了解常用测试仪器（示波器、误码仪、网络分析仪等）的基本使用，具备基础的电路测试与数据分析能力。

具备良好的问题分析与解决意识，能在指导下承担模块级设计任务，并逐步独立承担项目任务。

英语 CET-4 及以上，CET-6 优先；能阅读英文技术资料。

熟练使用 Office 办公软件（Word、Excel、PPT），具备良好的技术文档编写能力。

具备优秀的沟通能力和团队合作精神，学习能力强，责任心强，能承受一定工作压力；有电子设计竞赛、相关课题或光通信企业实习经验者优先。 Qualifications

Master's degree or above in Electronic Science and Technology, Electronic Information Engineering, Communication Engineering, Microelectronics, Automation, Optoelectronic Information, or related fields.

Basic knowledge of analog and digital circuits; understanding of high-speed circuit design and fundamental signal integrity concepts.

Understanding of schematic and PCB design flows; experience with EDA tools such as Cadence or Altium Designer is preferred.

Basic understanding of optical module principles and common optical/electrical interfaces; familiarity with industry standards such as IEEE 802.3, OIF, and MSA is a plus.

Familiar with the basic use of common test instruments (oscilloscopes, bit error rate testers, network analyzers, etc.), with basic circuit testing and data analysis capabilities.

Good problem-analysis and problem-solving mindset; able to take on module-level design tasks under guidance and gradually assume independent project responsibilities.

CET-4 or above (CET-6 preferred); able to read English technical materials .

Proficient in Microsoft Office (Word, Excel, PowerPoint) with good technical documentation skills.

Excellent communication and teamwork skills; fast learner with a strong sense of responsibility and ability to work under pressure; experience in electronics design competitions, related coursework/projects, or an internship at an optical communication company is preferred.