Interconnect Engineer (AI Infrastructure / Interconnect Solutions)

Key Responsibilities Interconnect Solution Development Develop and support interconnect solutions for AI servers, GPU, rack-level, and cluster-level platforms. Define cable and connector

based on system architecture, SI requirements, power delivery, thermal, and mechanical (and manufacturability) constraints. Support advanced interconnect applications, including:High-speed copper and optical interconnects Patch panels Optical cable assemblies Cable cartridge solutions Inter-rack DC link high-power connectivity Collaborate with SL, EE, SI, ME, Thermal, and System teams (and Manufacturing) to ensure robust (and scalable) interconnect architecture integration. High-Speed Interconnect Technology Support high-speed interconnection technologies, including (400G / 800G) interconnect solutions and future high-bandwidth AI infrastructure connectivity solutions. Evaluate and drive implementation readiness for emerging technologies such as PCIe Gen6/Gen7, UALink,NVLink, high-speed optical interconnects, and next-generation GPU cluster connectivity solutions. Drive technology readiness assessment and solution feasibility studies according to industry technology trends. Develop strategic supplier technology roadmaps aligned with future AI infrastructure interconnect technologies and deployment requirements. NPI & Engineering Support Lead and drive interconnect implementation activities throughout all NPI phases from concept development through EVT/DVT/PVT and sustaining. Own cable and connector component’s part list management, and interconnect technical documentation. Conduct NUDD analysis, engineering trade-off studies, risk analysis, and design reviews for Interconnect solutions. Lead sample verification, prototype bring-up, debugging, issue resolution and second source introduction during development phases. Supplier Development & Component Qualification Lead and develop strategic suppliers include technical engagement, capability assessment, and manufacturing readiness reviews. Define and execute qualification plans and reliability requirements for cable and connector components. Assess technical impact of PCN/PCR changes and define mitigation actions. Maintain interconnect qualification records, databases, and lifecycle documentation. Drive cost optimization, AVL strategy, and supply continuity planning. Required Qualifications Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field. 5+ years of experience in server, networking, storage, HPC, AI infrastructure, or high-speed interconnect engineering Strong knowledge of:High-speed cable and connector architectures Signal and power interconnect systems Qualification and reliability validation methods Rack-level and cluster-level interconnect solutions Experience working with ODM/OEM, EMS, and component suppliers. Strong cross-functional communication, technical problem-solving, and project execution skills. Preferred Qualifications Experience supporting AI server, GPU server, HPC, networking, or data center platforms. Familiarity with high-speed interconnect technologies (400G/800G, optical interconnect, UALink, NVLink, PCIe Gen6/Gen7, and next-generation AI fabric connectivity). Experience in NPI lifecycle management and supplier qualification processes. Understanding of signal integrity, power delivery, and thermal considerations in AI infrastructure systems. Experience supporting and bring-up supplier’s manufacturing and development sites is a plus.