联想
Air and Liquid Cooling Engineer
岗位职责
As an Air and Liquid Cooling System Engineer, you will lead the design, simulation, validation, and optimization of thermal and acoustic solutions for next-generation server, AI, HPC, and data center platforms. You will be responsible for developing innovative air and liquid cooling technologies, conducting thermal analysis and testing, and driving system-level design decisions to ensure product performance, reliability, and scalability. Working closely with global cross-functional teams, you will independently own thermal development projects from concept through product qualification while contributing to the advancement of cutting-edge cooling technologies for hyperscale and enterprise computing environments. Job
任职要求
Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, Energy Engineering, Aerospace Engineering, or a related discipline. 5+ years (or as required) of experience in thermal design and development for servers, storage systems, networking products, data center equipment, or other high-performance electronic systems. Strong understanding of heat transfer fundamentals, including conduction, convection, radiation, airflow/liquidflow management, and thermal interface materials. Hands-on experience with thermal simulation and CFD tools such as FloEFD, MacroFlow, FloTHERM, or equivalent. Proven experience in designing and optimizing thermal solutions involving heat sinks, fans, cold plates (CP), liquid cooling, coolant distribution units (CDU), or immersion cooling technologies. Experience developing and validating thermal management strategies, including fan speed control, thermal algorithms, and temperature monitoring methodologies. Familiarity with system thermal and acoustic testing, test plan development, data analysis, and product qualification processes. Demonstrated capability in thermal/acoustic troubleshooting, root cause analysis, and implementation of corrective actions throughout the product lifecycle. Strong understanding of server, workstation, AI, HPC, or data center hardware architectures and associated thermal challenges. Experience working closely with suppliers and manufacturing partners to drive design optimization, product quality, cost reduction, and production readiness. Ability to collaborate effectively with cross-functional teams, including Mechanical, Electrical, Firmware, Manufacturing, Quality, and Program Management functions. Strong project management, communication, and customer-facing skills, with the ability to present technical solutions and influence design decisions. Preferred Qualifications Experience with liquid cooling technologies for AI, GPU, HPC, or next-generation data center platforms. Knowledge of industry standards and specifications related to thermal and acoustic performance. Experience with statistical analysis, Design of Experiments (DOE), and reliability engineering methodologies. Familiarity with scripting or automation tools (Python, MATLAB, VBA, etc.) for thermal data analysis. Experience supporting OEM/ODM customers and participating in RFP/RFQ activities. Professional proficiency in English, with experience working in a global engineering environment.
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