009JFE-Power Electronics Hardware, Design Engineer

1. 01

   Main Circuit Design and Simulation: Responsible for the design, evaluation, and innovation of main power conversion topologies (e.g., AC/DC, DC/DC, DC/AC stages). Use simulation tools (e.g., PSPICE, LTspice, Saber, PLECS) for circuit simulation, including loop stability analysis, switching process analysis, and loss analysis, providing a theoretical basis for designs. Lead the design, calculation, and technical liaison with suppliers for key magnetic components (e.g., transformers, inductors).

2. 02

   Component Selection, Validation, and Lifespan Analysis: Responsible for the selection, evaluation, and testing of key components such as power semiconductors (IGBT, SiC MOSFET, GaN HEMT), capacitors, and magnetic components. Develop component validation test plans, and perform in-depth analysis of device characteristics, reliability, and potential failure modes. Conduct board-level power consumption and thermal analysis, collaborating with Structural/Thermal engineers to ensure system thermal design meets targets.

3. 03

   Board Design and Debugging: Lead or deeply participate in schematic design, and define PCB layout rules (especially for high-voltage, high-current, and sensitive signal sections). Guide Layout engineers to complete PCB design, ensuring it meets safety, EMC, thermal, and manufacturability

. Independently perform hardware board-level debugging, locate and resolve hardware issues, and conduct comprehensive validation of prototype performance and reliability.

4. 04

   Safety & EMC Design and Compliance: Strictly implement safety standards (e.g., UL 1741, IEC 62109) in hardware design, ensuring compliance with requirements like creepage and clearance distances. Consider EMC from the design source, formulate and implement EMC design schemes, and lead pre-compliance testing and troubleshooting/rectification during formal certification tests.

5. 05

   Test Validation and Production Transfer Support: Develop detailed hardware test plans, and execute design verification, system verification, and reliability testing. Analyze test data, write test reports, and be responsible for the completeness and accuracy of hardware design documentation. Support New Product Introduction (NPI), resolve hardware technical issues during pilot and mass production, and drive product design optimization and cost control. 职位概述 我们正在寻找一位富有创新精神的电力电子硬件工程师，加入我们的核心研发团队。您将主导新型电力系统中电力电子变换器的主拓扑设计、元器件选型与验证，直至产品成功量产。您是实现产品高性能、高可靠性及成本竞争力的关键力量。 主要职责

6. 01

   主电路设计与仿真： 负责功率变换主拓扑的设计、论证与创新（如AC/DC, DC/DC, DC/AC等阶段）。 运用仿真工具（如PSPICE, LTspice, Saber, PLECS）进行电路仿真，包括环路稳定性分析、开关过程分析和损耗分析，为设计提供理论依据。 主导关键磁性元器件（如变压器、电感）的设计、计算与供应商技术对接。

7. 02

   元器件选型、验证与寿命分析： 负责功率半导体（IGBT, SiC MOSFET, GaN HEMT）、电容、磁性元件等关键器件的选型、评估与测试。 制定元器件验证测试计划，深入分析器件特性、可靠性及潜在失效模式。 进行电路板的功耗与热分析，并与结构/散热工程师协作确保系统热设计达标。

8. 03

   电路板设计与调试： 主导或深度参与原理图设计，制定PCB布局布线规则（特别是高压、大电流、敏感信号部分）。 指导Layout工程师完成PCB设计，确保其满足安规、EMC、散热及可制造性要求。 独立完成硬件单板调试，定位并解决硬件问题，对样机性能及可靠性进行全面验证。

9. 04

   安规与EMC设计及合规性： 在硬件设计中严格贯彻安规标准（如UL1741, IEC62109），确保电气间隙、爬电距离等符合要求。 从设计源头考虑EMC问题，制定并实施EMC设计方案，主导产品前期预测试与正式认证测试的整改工作。

10. 05

    测试验证与转产支持： 制定详细的硬件测试计划，完成设计验证、系统验证及可靠性测试。 分析测试数据，编写测试报告，并负责硬件设计文档的完整性与准确性。 支持新产品导入，解决试产及量产过程中的硬件技术问题，推动产品设计优化与成本控制。 Qualifications & Requirements Education: Bachelor's degree or higher in Power Electronics, Electrical Engineering, Mechatronics Engineering, or a related field. Experience: Proven track record of independently being responsible for power-stage hardware development and successfully mass-producing products. Technical Skills: Topology & Simulation: Proficient in at least one common circuit simulation tool, with a deep understanding of loop compensation and transient processes. Component Knowledge: In-depth understanding of the characteristics, driving requirements, and application techniques of power semiconductors, capacitors, and other components. Design & Debugging: Substantial experience in schematic design and PCB layout. Skilled in using common test equipment (oscilloscopes, power analyzers, thermal imagers, etc.) for debugging and failure analysis. Safety & EMC: Familiar with product safety and EMC design standards, possessing relevant testing and problem-solving capabilities. Documentation: Ability to write standardized design documents, test reports, and technical materials. Personal Attributes: Strong hands-on ability, analytical and problem-solving skills. Passionate about technology, with excellent teamwork and communication skills. High sense of responsibility and the ability to manage multiple tasks in a fast-paced environment. Preferred Qualifications Experience with Wide Bandgap (WBG) semiconductor applications (e.g., SiC, GaN). Familiarity with digital control (DSP/MPU) hardware interface design and experience collaborating with software engineers on debugging. Hold patents or have published high-level technical papers in the field of power electronics. 教育背景： 电力电子、电气工程、机械电子工程及相关专业本科及以上学历。 专业技能： 拓扑与仿真： 精通至少一种常用电路仿真工具，对环路补偿、瞬态过程有深刻理解。 元器件知识： 深入理解功率半导体、电容等元器件的特性、驱动要求及应用技巧。 设计与调试： 具备丰富的原理图设计和PCB布局经验，能熟练使用常用测试设备（示波器、功率分析仪、热像仪等）进行调试与故障分析。 安规与EMC： 熟悉产品安规与EMC设计规范，具备一定的测试与问题整改能力。 文档能力： 能够编写规范的设计文档、测试报告和技术资料。 核心素质： 具备强大的动手能力、分析问题和解决问题的能力。 对技术充满热情，具备优秀的团队协作和沟通能力。 拥有高度的责任心和在快节奏环境中管理多项任务的能力。 优先考虑条件 具有SiC/GaN等宽禁带半导体应用开发经验者。 熟悉数字控制（DSP/MPU）硬件接口设计，具备与软件工程师协同调试经验者。 有电力电子相关专利或高水平技术论文者