IC Package NPI integrator

 include but not limited to:

1.Understand the bumping&assembly technology, strengths and weaknesses, design rules/spec, process input&output， material properties and participate in driving bumping & assembly improvements

2.Defines overall package performance and specification and realizes technology&material certification through layout design and test vehicle design.

3.Design DOE to resolve assembly issues related materials, process and equipment

4.Working effectively with partner and support groups to ensure effective planning, adherence to schedule, risk assessment, development and delivery of packaging projects.

5.Provides consultation concerning packaging problems and improvements in the packaging process.

6.Building strong relationships with peers, subcons and vendors, working synergistically in a very dynamic environment

The ideal candidate should exhibit the following behavioral traits:

Qualifications

Minimum Qualifications:

1.Masters (5+ years’ experience) Or Ph.D( 3+ years’ experience) in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry or Polymer Science.

2. 3+ years of experience in packaging module development positions

3. 3+ years of experience in packaging TD program management.

4. 3+ years of Experience and good understanding of AEC Q100

Preferred Qualifications:

1. Good understanding or experience of Semiconductor fabrication processes.

2. Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking.